Title:
熱伝導性複合シートの製造方法
Document Type and Number:
Japanese Patent JP6796569
Kind Code:
B2
Abstract:
To provide a manufacturing method of a thermally-conductive composite sheet capable of easily and stably laminating a high hardness thermally-conductive silicone layer and a low hardness thermally-conductive silicone layer of a thermally conductive composite sheet in a good adhesion state.SOLUTION: A manufacturing method of a thermally-conductive composite sheet includes simultaneously curing an uncured high hardness thermally-conductive silicone layer and an uncured low hardness thermally conductive silicone layer after laminating the uncured low hardness thermally-conductive silicone layer on the uncured high hardness thermally-conductive silicone layer containing an effective amount of an organic peroxide, and obtaining a thermally-conductive composite sheet including a high hardness thermally-conductive silicone layer having a Shore A hardness of 60 or more and 97 or less and a low hardness thermally-conductive silicone layer having an Asker C hardness of 50 or less.SELECTED DRAWING: None
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Inventors:
Yasuhisa Ishihara
Akihiro Endo
Minoru Igarashi
Akihiro Endo
Minoru Igarashi
Application Number:
JP2017197557A
Publication Date:
December 09, 2020
Filing Date:
October 11, 2017
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L23/373; B05D1/36; B05D7/24; B32B27/00; B32B37/00; H01L23/36; H05K7/20
Domestic Patent References:
| JP2009269337A | ||||
| JP2014193598A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi