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Patent Searching and Data


Title:
METHOD OF MANUFACTURING HEAT PIPE
Document Type and Number:
Japanese Patent JP2012220179
Kind Code:
A
Abstract:

To provide a heat pipe manufacturing method that makes it possible to reduce manufacturing costs.

The heat pipe where capillary members inside are formed by sintering of copper powders is manufactured by the following steps: a core rod 13 is inserted into a pipe 11 serving as the profile of the heat pipe to form a recessed groove between an interior wall of the pipe 11 and the core rod 13 (step (b)); copper powders 98 are packed in the recessed groove formed (step (c)); then the copper powders 98 packed are made such that the copper powders 98 stick together by an adhesive agent applied to the surfaces of the copper powders 98, so when the core rod 13 is taken out of the pipe 11, the copper powders 98 maintain the shape of the recessed groove (step (d)); thereafter, the pipe 11 is heated (step (e)); and one end of the pipe 11 is closed and a working solution is injected (step (f)). Thus, the core rod 13 can be taken out before heating, so that the damage to the core rod 13 can be prevented by a plurality of heat treatments.


Inventors:
ZENG QUAN-QI
LIU CHIH MING
Application Number:
JP2011101251A
Publication Date:
November 12, 2012
Filing Date:
April 28, 2011
Export Citation:
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Assignee:
TAI-SOL ELECTRONICS CO LTD
International Classes:
F28D15/02
Domestic Patent References:
JP2009068787A2009-04-02
JP2000039276A2000-02-08
JP2010025407A2010-02-04
JPH11190596A1999-07-13
Attorney, Agent or Firm:
Masaki Hattori