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Title:
METHOD OF MANUFACTURING HIGH FREQUENCY INDUCTOR
Document Type and Number:
Japanese Patent JP2014003289
Kind Code:
A
Abstract:

To provide a method of manufacturing a high frequency inductor capable of preventing damage on an electrode and degradation in the characteristics of a product.

The method of manufacturing a high frequency inductor includes a step for forming a primary coil required for manufacturing a high frequency inductor on a wafer, a step for coating the wafer on which the primary coil is formed with primary PSV, a step for forming a secondary coil after coating of the primary PSV, a step of coating a secondary PSV after forming the secondary coil, a step for forming a barrier layer 340 at a part of the exposed electrode of a high frequency inductor after coating of a secondary PSV, a step for filling an insulating resin 350 on the wafer after forming a barrier layer and then curing the resin, and a step for exposing an electrode 330 by polishing the resin thus cured down to the barrier layer.


Inventors:
YI SAN-MUN
YU YON-SUK
LEE JONG YUN
KWON YONG-DO
WI SEUNG GWON
Application Number:
JP2013112727A
Publication Date:
January 09, 2014
Filing Date:
May 29, 2013
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01F41/04; H01L21/3205; H01L21/768; H01L21/822; H01L27/04
Domestic Patent References:
JP2001244372A2001-09-07
JPH09504909A1997-05-13
JP2011091097A2011-05-06
JP2012104673A2012-05-31
JP2011071457A2011-04-07
JP2009253233A2009-10-29
JP2007073611A2007-03-22
JPH06216096A1994-08-05
Attorney, Agent or Firm:
Konobu Kato
Fukukawa Shinya