Title:
METHOD OF MANUFACTURING HIGH-VOLTAGE CIRCUIT PART HAVING INSERT-MOLDED LEAD FRAME
Document Type and Number:
Japanese Patent JP2002237422
Kind Code:
A
Abstract:
To provide a method of a high-voltage circuit part which can be used at high temperatures by welding an electronic part to a lead frame, is diminished in size, and improved in productivity and properties, such as mechanical strength and pressure resistance, by carrying out a forming process after the electronic part is mounted/welded onto a molded product which is easily worked.
Lead frame joints 2 provided to the lead frame 1 are made to protrude from a molded resin body through a primary insert molding process. The electronic part 3 is joined to the lead frame through the intermediary of the lead frame joints 2. Thereafter, a secondary insert molding process is carried out including the electronic part 3.
Inventors:
SUZUKI FUJIO
HARADA TAKAHIRO
HARIMA HIDEKAZU
HARADA TAKAHIRO
HARIMA HIDEKAZU
Application Number:
JP2001118454A
Publication Date:
August 23, 2002
Filing Date:
April 17, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C45/14; B29C45/16; H01F19/04; H01F27/32; H01F41/00; H01F41/04; H01F41/10; H01G13/00; (IPC1-7): H01F41/00; B29C45/14; B29C45/16; H01F19/04; H01G13/00
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)