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Title:
METHOD FOR MANUFACTURING HOLLOW DEVICE, HOLLOW DEVICE AND REACTION DEVICE HAVING HOLLOW DEVICE
Document Type and Number:
Japanese Patent JP2004009273
Kind Code:
A
Abstract:

To easily and accurately manufacture a hollow device having a hollow part having a fine and complicated pattern of nm-μm units at a low cost.

Copper foil (a base material 5 for a hollow part forming member) is supported by a dummy member 4, the copper foil is etched by solvent after plotting resist 6 into a prescribed pattern on the copper foil by ink jet, and the hollow part forming member 3 having the prescribed pattern specified by the resist 6 is formed. Subsequently, the hollow part forming member 3 and the dummy member 4 are removed after epoxy resin is poured into a metallic mold and hardened, to form a first device main body 12A having a recessed part 14A for the hollow part 14. A second device main body 12B having a solid surface is adhered to the first device main body 12A to manufacture the hollow device 10 having the hollow part 14.


Inventors:
TOMINAGA YASUSHI
NAKADA TAKAHIRO
YASUNAGA YUKARI
Application Number:
JP2002170178A
Publication Date:
January 15, 2004
Filing Date:
June 11, 2002
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B81C1/00; B29C39/12; B29C39/24; B29D22/00; B29K101/10; (IPC1-7): B81C1/00; B29C39/12; B29D22/00
Attorney, Agent or Firm:
Shinichi Kikuchi
Toru Kikuchi