To provide a method for manufacturing an inlet for a contactless type IC card which reduces the influence of thermal deformation of a wiring board and the contactless type IC card using the inlet manufactured by the method.

The method for manufacturing the inlet for the contactless type IC card which has a semiconductor chip 5 bonded at a fitting position provided on a wiring pattern 2 formed on one surface of the wiring board 1 and is sealed with sealing materials 3a and 3b at the fitting position and the position on the reverse side to the fitting position comprises: arranging the sealing material 3b at the position on the reverse side to the fitting position; arranging a reinforcing plate 4b which protects the semiconductor chip 5 at the position on the reverse side to the fitting position across the sealing material 3b; bonding the semiconductor chip 5 at the fitting position by hardening the sealing material 3b; arranging the sealing material 3a on the top surface of the semiconductor chip 5 and around the fitting position; and arranging the reinforcing plate 4b protecting the semiconductor chip 5 as an external layer of the semiconductor chip 5 across the sealing material 3b; and hardening the sealing material 3a.