Title:
接合材及び接合体の製造方法
Document Type and Number:
Japanese Patent JP6679909
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bond capable of forming a junction layer having a high share strength in spite of a heat treatment at a temperature lower than a conventional heating temperature, hard to thicken after storage for a long period of time, and having high storage stability, and a method of manufacturing a bonded body using the same.SOLUTION: The bond comprises: a silver powder having a particle distribution of primary particles which have a first peak in a range of particle sizes of 20-70 nm, and a second peak in a range of particle sizes of 200-500 nm; alkyl amine having a carbon number of 6-10, and a molecular weight in a range of 101.19-157.30; and at least one non-amine-based organic solvent selected from the group consisting of butyl carbitol acetate, dipropyleneglycol monomethyl ether, butyl carbitol, methyl pentanediol, and terpineol. The method of manufacturing a bonded body comprises forming a junction layer using the bond.SELECTED DRAWING: Figure 3
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Inventors:
Kotaro Masuyama
Mountain Saki Kazuhiko
Mountain Saki Kazuhiko
Application Number:
JP2015242067A
Publication Date:
April 15, 2020
Filing Date:
December 11, 2015
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B22F1/00; B22F1/02; B22F7/08; C04B37/02
Domestic Patent References:
| JP2011175871A | ||||
| JP2008161907A | ||||
| JP2011094223A | ||||
| JP2015206108A | ||||
| JP2008258147A |
Foreign References:
| WO2014185073A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga