Title:
METHOD FOR MANUFACTURING LAMINATE, LAMINATE, PRINTED CIRCUIT, DEVICE CIRCUIT, AND ELECTRIC AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2023145402
Kind Code:
A
Abstract:
To provide: a method for manufacturing a laminate of a fluorine resin and a metal (copper) film having high adhesion required for a practical level and high temperature resistance (260°C and 5 minutes) required when being used as an electronic substrate while maintaining smoothness of a nano-level; and a laminate of a fluorine resin and a metal (copper) film manufactured by the manufacturing method.SOLUTION: A method for manufacturing a laminate of a fluorine resin and a metal film includes: performing high frequency (RF) plasma treatment on a fluorine resin substrate while introducing ammonia gas thereto; Introducing a hydrophilic group into a surface of the fluorine resin substrate; treating the surface of the fluorine resin substrate by using a triazine-based molecular bonding agent; and then performing electroless plating treatment on the surface of the fluorine resin substrate.SELECTED DRAWING: None
Inventors:
KUWA SHIZUKA
HIRAHARA HIDETOSHI
AISAWA SUMIO
HIRAHARA HIDETOSHI
AISAWA SUMIO
Application Number:
JP2023050422A
Publication Date:
October 11, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
UNIV IWATE
International Classes:
B32B15/082; B32B15/08; C08J7/00; C08J7/12; C23C18/20; C23C18/34; C23C18/40; C23C18/52; C23C28/00; H05K1/03; H05K3/18; H05K3/38
Attorney, Agent or Firm:
Yoshihiro Shimizu
Kimiyoshi Nishimura
Kaoru Noda
Yuko Komatsu
Kimiyoshi Nishimura
Kaoru Noda
Yuko Komatsu