To provide a manufacturing method of a laminate that has nearly the same conductivity as that of a conventional metal thin film and has high adhesion properties to a substrate, and to provide a method for forming the metal thin film on the substrate without requiring high temperature.

The manufacturing method of the laminate includes a process for coating an insulating substrate with the solution of a non-thermoplastic polyimide-based resin-based resin precursor, converting one portion of the precursor to a thermoplastic polyimide-based resin by performing heat treatment for a solution removal/dehydrating condensation reaction, and forming a layer comprising the non-thermoplastic polyimide-based resin and non-thermoplastic polyimide-based resin precursor on the insulating substrate; and a process for coating the layer with a dispersing element containing metal thin-film precursor fine particles that are fused each other by heating while a primary particle diameter is ≤200 nm, performing heat treatment for converting the remaining precursor to the non-thermoplastic polyimide-based resin, and forming a metal thin-film layer on a layer comprising the non-thermoplastic polyimide-based resin.