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Patent Searching and Data


Title:
METHOD OF MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2004079556
Kind Code:
A
Abstract:

To provide a method of manufacturing a laminated ceramic electronic component in which not only structural defects, such as delamination etc., hardly occur, but also short circuits hardly occur between internal electrodes, and Ni powder-containing conductive paste is used.

This method of manufacturing the laminated ceramic electronic component includes a step of preparing a laminate 3 in which Ni paste layers 2A for internal electrode lie upon another through unbaked ceramic layers, a step of removing organic matters from the laminate 3 by heating the laminate 3, and a step of baking the laminate 3. This method also includes a step of forming external electrodes on the external surface of the sintered compact. When the mean particle diameter (a) of the Ni powder meets 0.1 μm≤a≤0.3 μm, 0.3 μm<a≤0.6 μm, and 0.6 μm<a≤1.0 μm, the quantity of organic matters left in the laminate after a defatting step is respectively controlled to 1.9-2.2 wt%, 0.7-1.9 wt%, and 0.4-0.7 wt% as the quantity of remaining carbon.


Inventors:
Ota, Tetsuhiko
Application Number:
JP2002000233424
Publication Date:
March 11, 2004
Filing Date:
August 09, 2002
Export Citation:
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Assignee:
MURATA MFG CO LTD
International Classes:
H01G4/12; H01G4/232; H01G4/30; H01G13/00; (IPC1-7): H01G4/12; H01G13/00
Attorney, Agent or Firm:
宮▼崎▲ 主税