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Patent Searching and Data


Title:
METHOD OF MANUFACTURING LAMINATED ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2001351822
Kind Code:
A
Abstract:

To provide a method of manufacturing a laminated electronic part, where a level difference hardly occurs at a boundary between inner electrodes, the laminated electronic part can be prevented from deteriorating in characteristics due to incorrect lamination and from delaminating due to a failure in bonding by application of pressure, and ceramic green sheets are excellent in handling properties and workability in a lamination process.

Adhesive agent 3 is applied on a ceramic green sheet 1, forming a pattern corresponding to an inner electrode pattern, a film 4 is pasted on the ceramic green sheet 1, then the film 4 is separated from the green sheet 1 to form a through-hole 5 having the shape corresponding to the pattern (inner electrode pattern) of the applied adhesive agent in the ceramic green sheet 1, a sheet on which an inner electrode material patterned as prescribed is applied is superposed on the green sheet with the through-hole 5 so as to fit the inner electrode pattern into the through-hole possessed of a prescribed pattern, the above sheets are bonded together into a laminate by application of pressure, and the laminate is fired.


Inventors:
TANAKA KANJI
Application Number:
JP2000173239A
Publication Date:
December 21, 2001
Filing Date:
June 09, 2000
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01F41/04; H01F17/00; (IPC1-7): H01F41/04; H01F17/00
Attorney, Agent or Firm:
Nishizawa Hitoshi