Title:
METHOD OF MANUFACTURING FOR LEAD FRAME AND ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3405303
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve a problem that many cutting scraps are recovered at a high cost in the case where unnecessary parts which are cut in the manufacturing step for lead frame for production of electronic parts are recovered for reuse.
SOLUTION: This lead frame 10 is provided with a plurality of pairs of leads 11 including leads 11a, 11b and 11c whose one end side is respectively connected with the main body 6 of an electronic part, and they are arranged with a specified interval in distance, and the middle part and the other end side are integrally connected by connecting lines 3 and 4, and then a feed hole 12 is arranged at a specified interval on the other end side of the lead. The arrangement width of the lead 11a, 11b and 11c is made smaller from the middle part to the other end side, and the feed hole 12 is arranged at the inner position than the other end of the lead among the respective leads 6.
Inventors:
Yoshiharu Kaneda
Application Number:
JP37041099A
Publication Date:
May 12, 2003
Filing Date:
December 27, 1999
Export Citation:
Assignee:
Kansai NEC Corporation
International Classes:
H01L23/48; H01L23/50; (IPC1-7): H01L23/48; H01L23/50