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Title:
METHOD OF MANUFACTURING LEAD WIRE TERMINAL FOR CHIP-TYPE ELECTROLYTIC CAPACITOR, AND CHIP-TYPE ELECTROLYTIC CAPACITOR
Document Type and Number:
Japanese Patent JP2019016761
Kind Code:
A
Abstract:
To suppress the generation of metal powder at a lead part of a chip-type electrolytic capacitor.SOLUTION: A method of manufacturing a lead wire terminal 4 for a chip-type electrolytic capacitor having a strip-shaped lead part 41 includes the steps of: preparing a metal wire 411 including a coating layer 412 with favorable solder wettability provided on an outer periphery thereof; and forming the lead part 41 by pinching the metal wire 411 between a first press die 110 and a second press die 120. Recessed portions 130 extending in an axial direction of the metal wire 411 are provided to at least one of a press surface 111 of the first press die 110 and a press surface 121 of the second press die 120.SELECTED DRAWING: Figure 3

Inventors:
YAMAZAKI MANABU
Application Number:
JP2017143082A
Publication Date:
January 31, 2019
Filing Date:
July 06, 2017
Export Citation:
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Assignee:
KOHOKU KOGYO KK
International Classes:
H01G9/008; H01G2/02; H01G9/00; H01G9/04