Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DIODE CHIP
Document Type and Number:
Japanese Patent JP2018182171
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting diode chip capable of obtaining sufficient luminance, and the light-emitting diode chip.SOLUTION: A method for manufacturing a light-emitting diode chip comprises: a wafer preparing step of preparing a wafer which includes a laminate layer in which a plurality of semiconductor layers containing a light-emitting layer are formed on a transparent substrate for crystal growth, and in which an LED circuit 19 is formed in each of the regions partitioned by a plurality of division schedule lines mutually crossing a surface of the laminate layer; a transparent substrate processing step of forming a plurality of recesses corresponding to each LED circuit on a surface or a rear surface of at least a first transparent substrate in which a plurality of air bubbles are formed inside or a second transparent substrate in which a plurality of through holes are formed across the whole surface; a transparent substrate sticking step of forming an integrated wafer by sticking a surface of the first transparent substrate to a rear surface of the wafer and a surface of the second transparent substrate to a rear surface of the first transparent substrate; and a dividing step of dividing the integrated wafer into individual light-emitting diode chips 31 by cutting the wafer together with the first transparent substrate and the second transparent substrate along the division schedule lines.SELECTED DRAWING: Figure 9

Inventors:
OKAMURA TAKU
KITAMURA HIROSHI
Application Number:
JP2017082268A
Publication Date:
November 15, 2018
Filing Date:
April 18, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/386; B28D5/02; H01L33/22
Domestic Patent References:
JP2012527742A2012-11-08
JP2009289815A2009-12-10
JP2016062899A2016-04-25
JP2009229507A2009-10-08
Foreign References:
WO2015030237A12015-03-05
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro