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Title:
METHOD FOR MANUFACTURING LIQUID EJECTING HEAD, AND METHOD FOR FORMING PIEZOELECTRIC ELEMENT
Document Type and Number:
Japanese Patent JP2011207071
Kind Code:
A
Abstract:

To provide a method for manufacturing a liquid ejecting head having piezoelectric elements that provide favorable and constant displacement charcteristics with improved crystallinity of the piezoelectric layer, and a method for forming the piezoelectric element.

The method includes: a step of forming a first electrode film 60 on a flow channel substrate wafer 110; a step of forming a first ferroelectric film 71a on the first electrode film; a step of etching the first ferroelectric film 71a and the first electrode film 60 with a resist film formed on the first ferroelectric film 71a as the mask; a first removal step of removing the resist film by ashing with oxygen plasma; a step of forming a protective resist; a second removal step of ultimately removing the resist film and the protective resist film by treatment with an organic remover; a step of forming additional ferroelectric films; and a step of forming a second electrode film on the piezoelectric layer, and then shaping the second electrode film and the ferroelectric films into a certain pattern to form the piezoelectric elements.


Inventors:
KISHIDA SANSEI
Application Number:
JP2010077505A
Publication Date:
October 20, 2011
Filing Date:
March 30, 2010
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/16; B41J2/045; B41J2/055; B41J2/135; B41J2/14; H01L41/09; H01L41/18; H01L41/187; H01L41/22; H01L41/311; H01L41/319; H01L41/332
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka