To provide a method for manufacturing a liquid jet head in which an adhesive reservoir is prevented from forming therein to achieve an improvement in yield.
The method includes: a step of forming a pressure generating element 300 on a first wafer 110; a step of joining the first wafer 110 to a second wafer 130 by means of an adhesive 35 to form a joined body 250; a step of wet-etching the first wafer 110 to form channels for a pressure generating chamber 12, etc.; and a step of dividing the joined body 250 into a plurality of chips in a predetermined size. The method also includes, prior to the step of forming the joined body 250, a step of forming, in the outer periphery of the joining surface of at least either of the first wafer 110 or the second wafer 130, a recessed part for a surplus of the adhesive 35 to be flowed therein.
Osamu Suzawa
Kazuhiko Miyasaka