To provide a method of manufacturing a mask in which a plating film is bonded directly to a frame not across a supporter screen to suppress a shape change of the plating film.
The plating film 3 is formed on a substrate, the frame 1 which is a rigid body is bonded onto the plating film 3, and the substrate is peeled off the plating film 3 to which the frame 1 is bonded. The plating film 3 has a plurality of openings penetrating the plating film 3 between the top and the reverse. The plurality of openings are formed so as to be distributed nearly equally over the entire surface of the plating film 3. The plurality of openings and a plurality of recesses which do not penetrate the plating film 3 between the top and the reverse, are formed so as to be distributed nearly equally over the entire surface of the plating film 3.
NAKAYAMA KIHEI
JPH0738231A | 1995-02-07 | |||
JP2001334629A | 2001-12-04 | |||
JP2006175700A | 2006-07-06 | |||
JPH07306521A | 1995-11-21 | |||
JPH0738231A | 1995-02-07 | |||
JP2001334629A | 2001-12-04 | |||
JP2006175700A | 2006-07-06 |