To provide a method for manufacturing a MEMS device, capable of skipping a wire breaking operation to be executed after an anodic bonding operation as an exclusive process for a common conducting wire which brings the potential of a movable electrode in a chip part to be equal to that of a fixed electrode in a sealing part.

The method includes: a bonding process of stacking a wafer 20 in which a plurality of chip parts 2A each having the movable electrode 8 are formed in the shape of a matrix, and a sealing glass 30 in which a plurality of sealing parts 3A each having the fixed electrode 7 are formed in the shape of a matrix, and applying the anodic bonding operation to them; and a dicing process of dicing the wafer 20 and sealing glass 30 being made anodic-bonded along a scribe line 40, thereby obtaining a plurality of MEMS devices 1 each being made up of the anodic-bonded chip part 2A and sealing part 3A. Furthermore, a plurality of common conducting wires 16 for conducting the movable electrode 8 and the fixed electrode 7 are patterned in units of the chip part 2A in an inside area of the line width W of the scribe line 40.

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