To provide a manufacturing method capable of keeping a neatly arranged state when a sacrificial layer is finally removed in manufacturing a MEMS device.

The manufacturing method includes: a step of forming a seed layer 2 on a base substrate 1; a step of forming a conductive metallic material layer 3 on the seed layer 2; a step of forming a resist layer 4 and forming a plurality of apertures 6 on the resist layer 4; a step of filling a conductive metallic material in the apertures 6 to form a plurality of fixing posts 5 and removing the resist layer 4; a step of forming the sacrificial layer covering the fixing post 5 and grinding the sacrificial layer flat until the fixing post 5 is exposed; a step of forming a new resist layer on the sacrificial layer and repeating a step of filling an aperture provided on the resist layer with the conductive metallic material, thereby stacking the conductive material and forming the device; and a step of removing the resist layer and the sacrificial layer. At least two or more fixing posts 5 are assigned for one device, and when the sacrificial layer is removed, each device is limited in horizontal movement by the fixing post 5.