To provide methods of manufacturing a metal foil laminate and a wiring board, where the metal foil laminate with a flat surface can be formed and improved in mass productivity because a gap for the lamination of metal foils can be controlled easily, and the problem caused due to solution hardly occurs when an adhesive layer is formed.
A method of manufacturing a metal foil laminate comprises a first process of forming an adhesive layer 12 that contains thermosetting resin on a lower wiring layer, a metal layer 1 or an insulation layer, a second process of temporarily attaches a porous layer 13 where a releasing film 11 is attached to the surface of the adhesive layer 12, a third process of separating the release type film 11 from the porous layer 13, a fourth process of laminating a metal foil 20 on the porous layer 13 where the releasing film 11 has been separated off, and a fifth process of thermocompressing the laminate, to shift the adhesive layer 12 to the metal foil 20 and combining them into one piece.
TAWARA SHINJI
IKEDA KENICHI
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