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Title:
METHOD FOR MANUFACTURING METAL FOIL WITH PATTERN FORMED THEREON, METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTOR LAYER PATTERN, AND CONDUCTIVE SUBSTRATE FOR PLATING AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011032522
Kind Code:
A
Abstract:

To provide a method for manufacturing patterned metal foil by which various types of fine-patterned metal foil can be produced.

The method for manufacturing metal foil with a pattern formed on at least one side thereof, includes the steps of: (A) precipitating metal by plating on a conductive surface of a conductive substrate for plating in which a recess is formed on the surface, the recess being formed so as to widen toward the opening direction; and (B) releasing the metal precipitated on the surface of the conductive substrate for plating.


Inventors:
SUZUKI KYOSUKE
NAOYUKI SUSUMU
Application Number:
JP2009179083A
Publication Date:
February 17, 2011
Filing Date:
July 31, 2009
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C25D1/04; C23C18/31; C25D1/10