To provide a method capable of efficiently forming a highly adhesive insulation film in forming a circuit on a nitride-aluminum-based substrate.
The method includes: a step of forming an insulation film on a surface of the nitride-aluminum-based substrate; a step of forming a conductive underlying film on a surface of the insulation film; a step of removing the underlying film by electromagnetic irradiation along an outline of a circuit pattern of a conductor circuit to be formed, thereby insulating a part to serve as the conductor circuit from a part where the conductor circuit is not formed; and a step of applying electrolytic plating on the underlying film to serve as the conductor circuit, thereby thickening the film to form the conductor circuit. After a region where the conductor circuit is formed and a part other than its peripheral region are masked in forming the insulation film, the insulation film is formed only in the region where the conductor circuit is formed and its peripheral region by thermal spraying.
COPYRIGHT: (C)2010,JPO&INPIT
Masataka Otani
Masaru Egawa
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