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Title:
METHOD OF MANUFACTURING MOLDED COIL
Document Type and Number:
Japanese Patent JP2009253189
Kind Code:
A
Abstract:

To provide a method of manufacturing a molded coil that does not require an expensive material having a heat resistance and elasticity, suppresses the influence of a leaked resin that affects the terminal part of the coil to a short dimension range, and thereby which is capable of secure electrical connection at the terminal part of the coil in a space-saving manner, without requiring a large dimension for the terminal part of the coil required for the electrical connection.

The method of manufacturing a molded coil that is an integration of a coil 10 and resin, in which the coil body 11 is placed in a state, where the coil body 11 is arranged in a mold 40, and at the same time, a coil terminal part 12 projecting from the coil body is led out to the outside of the mold 40, and a resin is injected into the mold 40 in this state, and thus the coil and the resin are integrated, wherein a damming up member 20 that dams up the resin that leaks out of the mold 40 along the coil terminal part 12 is provided in the vicinity of the outside of the mold 40 of the coil terminal part 12.


Inventors:
MEMEZAWA IZUMI
NOMURA YASUSHI
HIROTA MASAYOSHI
Application Number:
JP2008102226A
Publication Date:
October 29, 2009
Filing Date:
April 10, 2008
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01F41/12; H01F27/32; H01F41/04
Attorney, Agent or Firm:
Patent Corporation Heart Cluster
Rikio Murota