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Title:
METHOD FOR MANUFACTURING MULTI-LAYER THREE-DIMENSIONAL STRUCTURE
Document Type and Number:
Japanese Patent JP2012052242
Kind Code:
A
Abstract:

To form a multi-layer three-dimensional structure by electrodepositing both of a structural material and a sacrificial material on a substrate.

A method for manufacturing the multi-layer three-dimensional structure includes the steps of: bringing the substrate 2 to be plated into contact with a first article 4a which includes a mask 6 and a support 8; depositing a first metal 12 (for instance, sacrificial metal) on the substrate in the presence of a first metal ion source; bringing the substrate 2 into contact with a second article 14 which includes a mask 16 and a support 18; depositing a second metal 20 (for instance, structural metal) on the substrate in the presence of a second metal ion source; and planarizing the layer. The method is repeated by using electroplating articles 4a, 4b, 14a and 14b, which have different patterns, to produce a multi-layer structure 24. An element 26 is obtained by etching all of the sacrificial metal 12.


Inventors:
COHEN ADAM L
Application Number:
JP2011260617A
Publication Date:
March 15, 2012
Filing Date:
November 29, 2011
Export Citation:
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Assignee:
UNIV SOUTHERN CALIFORNIA
International Classes:
B81C1/00; C25D1/00; B21C37/00; C23F1/00; C25D1/10; C25D5/02; C25D5/10; C25D7/12; C25D17/06; C25D19/00; C25D21/12; H01L21/288; H05K3/24; C25D
Domestic Patent References:
JPH0645232A1994-02-18
JPH0874099A1996-03-19
Attorney, Agent or Firm:
Yoji Ito
Fumihiro Mizuno