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Title:
METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT, GREEN SHEET PAINT USED IN THE METHOD AND METHOD FOR MANUFACTURING MULTILAYER UNIT
Document Type and Number:
Japanese Patent JP2012153567
Kind Code:
A
Abstract:

To provide a multilayer electronic component manufacturing method that causes no sheet attack phenomenon in manufacturing a multilayer electronic component using a so-called multi manufacturing method and thus provides a resultant electronic component experiencing a reduced rate of a short-circuit defect, a green sheet paint used in the method and a method for manufacturing a multilayer unit using the green sheet paint.

A green sheet paint includes dielectric powder, a binder resin and a mixed solvent comprised of two or more kinds of solvents, wherein the solubility parameter (δmix) of the mixed solvent is 9.3 to 10.3, the binder resin is a butyral-based resin, the content of the binder resin is 10 to 26 pts.wt. relative to 100 pts.wt. of the dielectric powder.


Inventors:
KAJIYAMA SHOHEI
SHIMIZU YUTAKA
WATABE TOMOYUKI
Application Number:
JP2011014311A
Publication Date:
August 16, 2012
Filing Date:
January 26, 2011
Export Citation:
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Assignee:
TDK CORP
International Classes:
C04B35/622; B28B11/00; C04B35/632; H01G4/12; H01G4/30
Attorney, Agent or Firm:
Hitoshi Maeda
Toru Suzuki