To provide a multilayer electronic component manufacturing method that causes no sheet attack phenomenon in manufacturing a multilayer electronic component using a so-called multi manufacturing method and thus provides a resultant electronic component experiencing a reduced rate of a short-circuit defect, a green sheet paint used in the method and a method for manufacturing a multilayer unit using the green sheet paint.
A green sheet paint includes dielectric powder, a binder resin and a mixed solvent comprised of two or more kinds of solvents, wherein the solubility parameter (δmix) of the mixed solvent is 9.3 to 10.3, the binder resin is a butyral-based resin, the content of the binder resin is 10 to 26 pts.wt. relative to 100 pts.wt. of the dielectric powder.
SHIMIZU YUTAKA
WATABE TOMOYUKI
Toru Suzuki
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