Title:
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH09191185
Kind Code:
A
Abstract:
To provide a method for efficiently manufacturing a high-density multilayer printed wiring board.
For manufacturing a multilayer printed wiring board, a thermoplastic resin sheet is used as a cushion preventing the flow of resin in a via which is modified by a plastic fluid fluorine or silicon compound, exhibits a high fluidity, includes a substitution group containing fluorine or silicon in the side chain and also has an elastic modulus smaller than or equal to that of an insulating adhesive layer at its melting point or softening point.
Inventors:
YAMAMOTO KAZUNORI
NAKASO AKISHI
TSURU YOSHIYUKI
TAKAHASHI ATSUSHI
MADARAME TAKESHI
INADA TEIICHI
OTSUKA KAZUHISA
ARIGA SHIGEHARU
NAKASO AKISHI
TSURU YOSHIYUKI
TAKAHASHI ATSUSHI
MADARAME TAKESHI
INADA TEIICHI
OTSUKA KAZUHISA
ARIGA SHIGEHARU
Application Number:
JP301196A
Publication Date:
July 22, 1997
Filing Date:
January 11, 1996
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Kunihiko Wakabayashi