To provide a multilayered laminated body in which substrate internal stress is relaxed, thereby alleviating the warp after circuit forming and improving the product yield by suppressing a resin from releasing its stress through contraction after removing a copper foil of an outermost layer etching or the like, in a circuit forming process, and a resin which has lost the support of the copper foil.

The method of manufacturing a multilayered laminated body includes superimposing a prepreg and a sheet like material of a metal foil; and heating and pressing this, wherein the thickness of the prepreg is 0.8 mm or less, the metal foil is laminated to the one side or both sides of the prepreg, and a press plate having a linear coefficient of thermal expansion which is larger than that of the metal foil by 1.2 times or more and a thickness which is 10 times or more is superimposed on the prepreg to be heated and pressed.