To provide a method for manufacturing a nozzle substrate capable of readily manufacturing a nozzle substrate that can be bonded by anodic bonding to a cavity substrate having a liquid droplet fluid channel of a liquid droplet ejection head formed thereon.
The method for manufacturing a nozzle substrate includes a process of forming a recessed portion 103 to be a first nozzle hole at a liquid droplet ejection side on one face of a silicon substrate 100, a process of forming an ink-resistance protection film 104 on the entire surface of the silicon substrate 100 including an inner wall of the recessed portion 103, a process of forming a recessed portion 111 to be a second nozzle hole at a liquid droplet supply side on one face of a glass substrate 110, a process of anodically bonding one face of the silicon substrate 100 with one face of the glass substrate 110 so as to make the recessed portion 103 to face the recessed portion 111, a process of thinning the other face of the glass substrate 110 until the bottom face of the recessed portion 111 is opened so as to form the second nozzle hole 11b, and a process of thinning the other face of the silicon substrate 100 until the bottom face of the recessed portion 103 is opened so as to form the first nozzle hole 11a.
COPYRIGHT: (C)2010,JPO&INPIT
| JP2008062414A | 2008-03-21 | |||
| JP2008100438A | 2008-05-01 | |||
| JP2009029018A | 2009-02-12 | |||
| JP2001071510A | 2001-03-21 | |||
| JP2006187934A | 2006-07-20 | |||
| JP2007253373A | 2007-10-04 | |||
| JPH0994965A | 1997-04-08 |
| WO2008072518A1 | 2008-06-19 |
Osamu Suzawa
Kazuhiko Miyasaka