To provide a method of manufacturing an optical scanner capable of processing an optical scanner element as an individual piece while preventing damages on an optical scanner element structure without using a complex and expensive method.

When a wafer for forming an optical scanner is processed according to a predetermined optical scanner element pattern, the rear surface side of the wafer 11 is processed at first. A support substrate 14 is permanently joined on the rear surface side. A resist pattern 16 is formed for processing the front side of the wafer 11. The wafer 11 is subjected to full dicing from the front side while the support substrate 14 is subjected to half dicing and the front side of the wafer 11 is processed. Thereafter, the wafer 11 is adhered onto a self-adhesive film 17 spread on a rim with the support substrate 14 facing the film side. The wafer 11 is separated into individual optical scanner element chips by being breaking-cut by applying a push-up force to the support substrate 14 from the rear surface side of the wafer 11 while self-adhesive film 17 being expanded.