To provide a method for manufacturing a package, capable of efficiently manufacturing the package.

The method for manufacturing the package includes a through electrode formation step of forming a through electrode which penetrates a first substrate 40 in the thickness direction to conduct the inside of a cavity and the outside of a package, wherein the through electrode formation step includes: a through hole formation step of forming through holes 30, 31 on the first substrate 40; a stud arrangement step of inserting a core material part 7 of a conductive stud 9 having a planar foundation part 8, and a core material part 7 erected on the surface of the foundation part 8 into the through holes 30, 31. The core material part 7 is inserted into the through holes 30, 31 by forming the through holes 30, 31 in the inverse-tapered shape whose diameter is gradually extended from the side of a first surface 40a of the first substrate 40 toward the side of a second surface 40b opposite to the first surface 40a in the through hole formation step, and attracting the stud 9 from the side of the second surface 40b through the through holes 30, 31 while moving the stud 9 on the first surface 40a by turning the first surface 40a of the first substrate 40 upward in the stud arrangement step.