Title:
METHOD FOR MANUFACTURING PACKAGE WITH RFID TAG AND PACKAGE WITH RFID TAG
Document Type and Number:
Japanese Patent JP2015170246
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a tablet package with an RFID tag that is easy to form a slit.SOLUTION: A tablet package includes a resin sheet 111 capable of accommodating a tablet 200 and a metal sheet 112 glued to the resin sheet 111, and performs radio information communication by using the metal sheet 112 as an antenna. A method for manufacturing the tablet package includes the steps of: gluing the resin sheet 111 and the metal sheet 112 together to seal the tablet 200; forming a slit SLT on the metal sheet; and mounting an IC chip on the metal sheet 112. In the gluing step, a non-glued part is provided where the resin sheet 111 and the metal sheet 112 are not glued together in part of a region including a region where the slit SLT is formed.
Inventors:
KAWASE TSUTOMU
HIRAMATSU MOTOI
HIRAMATSU MOTOI
Application Number:
JP2014046023A
Publication Date:
September 28, 2015
Filing Date:
March 10, 2014
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
G06K19/077; B65B9/04; B65B15/04; B65D75/36; B65D83/04; G06K19/07
Attorney, Agent or Firm:
Atsushi Tateishi
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