Title:
感光性樹脂組成物及び硬化レリーフパターンの製造方法
Document Type and Number:
Japanese Patent JP6797866
Kind Code:
B2
Abstract:
A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).
Inventors:
Tomohiro Yorisue
Mitsutaka Nakamura
Taihei Inoue
Tatsuya Hirata
Takahiro Sasaki
Mitsutaka Nakamura
Taihei Inoue
Tatsuya Hirata
Takahiro Sasaki
Application Number:
JP2018128480A
Publication Date:
December 09, 2020
Filing Date:
July 05, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/027; C08F290/14; C08F299/02; C08G73/12; G03F7/20
Domestic Patent References:
| JP2015187676A | ||||
| JP2011123219A | ||||
| JP2006117561A | ||||
| JP2016029479A | ||||
| JP2006193691A | ||||
| JP2016079340A | ||||
| JP5086154A |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima