To provide a method of manufacturing piezoelectric devices in which materials of the substrate are not limited and productivity can be improved, and to provide an element substrate.
The method of manufacturing the piezoelectric devices includes the steps of: forming partition walls 2 partitioning element areas A on a substrate 10; forming piezoelectric elements (SAW elements 100) in the element areas A; forming grooves 2b which introduce a dicing blade into the partition walls 2; forming, on the partition walls 2, upper partition walls 3 including first openings 3a communicated with the element areas A and second openings 3b communicated with the grooves 2b; performing a frequency adjustment on the piezoelectric elements through the first openings 3a; and individually dividing it into the formed piezoelectric devices by introducing the dicing blade into the grooves 2b.
Osamu Suzawa
Kazuhiko Miyasaka
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