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Title:
METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
Document Type and Number:
Japanese Patent JP2010135973
Kind Code:
A
Abstract:

To provide a method for manufacturing a piezoelectric device which is free of the risk of disconnection and has a stable frequency, and to provide the piezoelectric device.

The method for manufacturing a piezoelectric vibrating piece includes a forming step (S110) of forming a piezoelectric vibrating piece 20, namely, a profile of a piezoelectric vibrating piece 30 from a piezoelectric wafer; a first metal layer depositing step (S114) of depositing a first metal layer, including Cr on the surface of the piezoelectric vibrating piece; an oxidation step (S116) of oxidizing the first metal layer; a foundation layer forming step (S120) of depositing a foundation layer, further foundation layer forming step (S118) for forming a foundation layer of Cr on the oxidized first metal layer; a second metal layer depositing step () of depositing a second metal layer, including Au on the foundation layer; an electrode pattern forming step (S124) of forming an electrode pattern on the first and second metal layers; and a removal step (S130) of removing the second metal layer of the electrode pattern at a prescribed location on the piezoelectric vibrating piece.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
UMEKI SATOSHI
INOUE TAKAHIRO
AMANO YOSHIAKI
SAITO TAKESHI
Application Number:
JP2008308366A
Publication Date:
June 17, 2010
Filing Date:
December 03, 2008
Export Citation:
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Assignee:
NIHON DEMPA KOGYO CO
International Classes:
H03H3/02; H01L41/09; H01L41/18; H01L41/22; H01L41/23; H01L41/29; H01L41/332; H03H9/19; H03H9/215
Domestic Patent References:
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Attorney, Agent or Firm:
Nobukazu Ito