To provide a method of manufacturing a piezoelectric oscillator, along with a piezoelectric oscillator, capable of assuring the space of a cavity by forming an inspection electrode on the upper surface of the piezoelectric oscillator.

The method of manufacturing a piezoelectric oscillator includes: a step (S101) for preparing a piezoelectric wafer in which a plurality of piezoelectric vibration elements having a piezoelectric piece and an outer frame are formed; a step (S103) for preparing a first wafer in which a plurality of first containers having an inspection electrode are formed, and in which a plurality of through holes are formed on the side shared by adjoining first containers while a connection electrode is formed in the through hole; a step (S104) for preparing a second wafer in which a plurality of second containers having an external electrode are formed; a step (S102) for preparing a plurality of integrated circuits; a joining step (S105) for placing an integrated circuit in the first container or the second container, and joining the piezoelectric wafer, the first wafer, and the second wafer; and a measurement step (S107) for measuring at least either a CI value of the piezoelectric piece or a vibration frequency through the inspection electrode.