Title:
METHOD FOR MANUFACTURING PLATED EXTRA-FINE WIRE
Document Type and Number:
Japanese Patent JP2006307277
Kind Code:
A
Abstract:
To provide a method for manufacturing a plated extra-fine wire, which hardly breaks the wire and has superior production efficiency.
This manufacturing method comprises the steps of: firstly forming an Ag-plated layer which is harder than a rod material made from copper or a copper alloy and has a Vickers hardness (Hv) of 100 to 150, on the surface of the rod material by using a cyan plating bath containing selenium of 20 to 40 ppm; and then wire-drawing the rod material having the Ag-plated layer formed thereon into the plated extra-fine wire having the diameter of less than 50 μm.
Inventors:
YAMADA TSUYOSHI
NAOE KUNIHIRO
MIMURA SHOJI
NAOE KUNIHIRO
MIMURA SHOJI
Application Number:
JP2005130499A
Publication Date:
November 09, 2006
Filing Date:
April 27, 2005
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
C25D7/06; B21C1/00; C25D3/46; H01B13/00
Attorney, Agent or Firm:
Masanori Fujimaki
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