Title:
METHOD FOR MANUFACTURING PLATED NAIL
Document Type and Number:
Japanese Patent JP3838908
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a plated nail excellent in corrosion resistance and durability rather than a conventional electroplated nail without discoloring neighboring lumbers even if nail head regions are wet by rain, and capable of extremely, efficiently and inexpensively manufacturing excellent nails in a continuous process and at fewer process steps.
SOLUTION: A hot-dipped wire 10 having a hot-dipped layer 12 of a non ferrous metal on the surface of a core material 11 which is composed of almost exclusively iron is cut to a prescribed length, and, by a punching process in the side of a cut end 20a, and nail head portion 1a is formed.
Inventors:
Masanobu Kusetsu
Application Number:
JP2001386100A
Publication Date:
October 25, 2006
Filing Date:
December 19, 2001
Export Citation:
Assignee:
Amatei Co., Ltd.
International Classes:
B21G3/12; B21G3/16; B21G3/32; C23C2/38; (IPC1-7): B21G3/12; B21G3/16; B21G3/32; C23C2/38
Domestic Patent References:
| JP59157740U | ||||
| JP63025225U | ||||
| JP3052735A | ||||
| JP3005103U |
Attorney, Agent or Firm:
Tadashi Fujikawa
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