Title:
メッキ用パターン版及び配線基板の製造方法
Document Type and Number:
Japanese Patent JP7426560
Kind Code:
B2
Abstract:
A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.
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Inventors:
Takayoshi Nirenki
Hideo Iguchi
Hideo Iguchi
Application Number:
JP2020565613A
Publication Date:
February 02, 2024
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K3/20; C23C18/32; H05K3/18
Domestic Patent References:
| JP2001127409A | ||||
| JP2007266324A | ||||
| JP2005183512A | ||||
| JP2159789A | ||||
| JP4798439B2 | ||||
| JP11274694A |
Attorney, Agent or Firm:
Kenji Kamada
Kenji Maeda
Kenji Maeda
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