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Title:
METHOD OF MANUFACTURING POLISHING PAD MOLDING DIE, POLISHING PAD MOLDING DIE MANUFACTURED BY THE SAME METHOD, AND POLISHING PAD MANUFACTURED BY THE SAME DIE
Document Type and Number:
Japanese Patent JP2014008692
Kind Code:
A
Abstract:

To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, and a polishing pad manufactured by the die.

A method of manufacturing a polishing pad molding die 10 for a polishing pad 13 on which a micro pattern A having fine protrusions 12 arranged thereon has: a positive die fabrication process of forming fine reaction protrusions having the same dimensions as the fine protrusions 12 in accordance with arrangement of the fine protrusions 12 on one surface side of a substrate to fabricate a positive die having a micro pattern B on which the fine reaction protrusions are arrayed; a negative die fabrication process of fabricating a negative die on which a micro pattern C, in which fine recesses having the same dimensions as the fine reaction protrusions and an inverted concavo-convex relationship are arrayed, is formed, from the positive die at a position corresponding to the fine reaction protrusions; and an assembly process of closely arranging the negative die 18 on a base 17 while setting the surface on which the micro pattern C is formed to a front side to fabricate the polishing pad molding die 10.


Inventors:
TASHIRO YASUNORI
TAKADA MASATO
NAKA TOSHIAKI
MATSUO MASAAKI
ITO TAKAHIRO
SUZUKI YOSHITOMO
KIMURA KEIICHI
KHAJORNRUNGRUANG PANART
Application Number:
JP2012147422A
Publication Date:
January 20, 2014
Filing Date:
June 29, 2012
Export Citation:
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Assignee:
MISHIMA KOSAN CO LTD
KYUSHU INST TECHNOLOGY
International Classes:
B29C33/38; B24B37/26; H01L21/304
Attorney, Agent or Firm:
Fujio Nakamae
Yohei Kiyoi
Yoshihiro Kurita
Takayuki Imanaka