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Title:
METHOD FOR MANUFACTURING POLYIMIDE FILM COMPOSITION, POLYIMIDE FILM COMPOSITION, ENDLESS BELT, FIXING BELT AND OPC PHOTOSENSITIVE BODY
Document Type and Number:
Japanese Patent JP2002292657
Kind Code:
A
Abstract:

To provide a method for manufacturing a polyimide film composition which enhances adhesion of a metal layer.

In the method for manufacturing the polyimide film composition, a polyimide precursor-containing liquid (A) is applied to the surface of a substrate and dried or semi-cured to form a precursor resin layer and a polyimide precursor-containing liquid (B) having a metal powder dispersed therein is applied to the precursor resin layer and cured under heating to form a polyimide resin layer and a metal dispersed polyimide resin layer, and the metal layer is formed on the metal dispersed polyimide resin layer. Alternatively, the polyimide precursor-containing liquid (A) is applied to the surface of the substrate to be cured under heating to form the polyimide resin layer and the polyimide precursor-containing liquid (B) having the metal powder dispersed therein is apaplied to the polyimide resin layer and cured under heating to form the metal dispersed polyimide resin layer and the metal layer is formed on the metal dispersed polyimide resin layer.


Inventors:
Yashiki, Yuichi
Application Number:
JP2001000094233
Publication Date:
October 09, 2002
Filing Date:
March 28, 2001
Export Citation:
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Assignee:
FUJI XEROX CO LTD
International Classes:
G03G15/20; B29C41/14; B29C41/22; B29C41/42; G03G5/10; G03G21/00; G03G15/20; B29C41/14; B29C41/22; B29C41/34; G03G5/10; G03G21/00; (IPC1-7): B29C41/14; B29C41/22; B29C41/42; G03G5/10; G03G15/20; G03G21/00