Title:
METHOD FOR MANUFACTURING POLYMERIC COMPOUND FOR PHOTORESIST, AND RESIN COMPOSITION FOR PHOTORESIST
Document Type and Number:
Japanese Patent JP3963724
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a polymeric compound for a photoresist highly soluble in a resist solvent comprising a glycol-based solvent, an ester-based solvent, a ketone-based solvent or the like.
SOLUTION: The method for manufacturing a polymeric compound for a photoresist exhibiting changes in solubility in an alkali by an action of an acid comprises a step for polymerization using as a polymerization solvent one or more solvents selected among a glycol-based solvent, an ester-based solvent and a ketone-based solvent followed by a filtration treatment of the polymerization reaction liquid containing the resultant polymer. Preferably, the polymerization solvent is at least one selected among propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl lactate and methyl isobutyl ketone.
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Inventors:
Takashi Arai
Masashi Suto
Masamichi Nishimura
Masashi Suto
Masamichi Nishimura
Application Number:
JP2002003936A
Publication Date:
August 22, 2007
Filing Date:
January 10, 2002
Export Citation:
Assignee:
Daicel Chemical Industry Co., Ltd.
International Classes:
C08F6/06; G03F7/039; C08F20/18; C08F20/28; (IPC1-7): C08F6/06; C08F20/18; C08F20/28; G03F7/039
Domestic Patent References:
| JP2002006501A | ||||
| JP2001192569A | ||||
| JP2001064325A | ||||
| JP2001240625A |
Attorney, Agent or Firm:
Yukihisa Goto