Title:
METHOD FOR MANUFACTURING PREPREG FOR INSULATION, PREPREG FOR INSULATION AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2005053965
Kind Code:
A
Abstract:
To provide a method for manufacturing a prepreg for insulation which neither deforms nor damages a base material and can manufacture the prepreg for insulation so as not to leave even fine voids behind, a fine void-free prepreg for insulation obtained by uniformly impregnating a base material with a resin, and a circuit board.
The method for manufacturing the prepreg for insulation comprises bringing a fluid in a high-pressure state obtained by melting a matrix resin into contact with a fibrous base material to impregnate the fibrous base material with the matrix resin.
Inventors:
YAMAMOTO TAKAYUKI
MURAKAMI YOSHIAKI
MURAKAMI YOSHIAKI
Application Number:
JP2003206085A
Publication Date:
March 03, 2005
Filing Date:
August 05, 2003
Export Citation:
Assignee:
NITTO DENKO CORP
NITTO SHINKO KK
NITTO SHINKO KK
International Classes:
C08J5/24; H01B17/60; H01B19/02; (IPC1-7): C08J5/24; H01B17/60; H01B19/02
Attorney, Agent or Firm:
Noboru Fujimoto
Suzuki Katsuto
Seiichi Yakumaru
Hiroaki Nakatani
Minoru Ohnaka
Suzuki Katsuto
Seiichi Yakumaru
Hiroaki Nakatani
Minoru Ohnaka