To change the film thickness of printed bodies in a plane through single printing, without processing a board, in a method of manufacturing a printed board having the printed bodies formed by printing on one surface of the board.
As printed bodies 21 and 22, a first printed body 21 and a second printed body 22 which is thinner than the first printed body 21 are formed. A paste supply process and a squeegee coating process are performed using a mask 30, in which a side face of a through-hole 42 for forming the second printed body 22 is not parallel to a plate thickness direction of the mask 30 and the direction of the face is a non-parallel surface 42a directed to the other surface 32 side of the mask 30. After that, in a mask removing process, when the mask 30 is moved to the upper side of the one surface 12 of the board 11, a part of paste 50 positioned inside the through-hole 42 for forming the second printed body 22 is scooped up with the non-parallel surface 42a to be removed from the board 11 together with the mask 30.
SAGAWA HARUHIDE
| JPH1134291A | 1999-02-09 | |||
| JPH10151873A | 1998-06-09 | |||
| JPH10151872A | 1998-06-09 | |||
| JPH05112082A | 1993-05-07 | |||
| JPH0878831A | 1996-03-22 |
Takahiro Miura
Fumihiro Mizuno
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