To obtain a high-density printed circuit substrate in which a pattern having proper copper foil adhesive force and a good shape is manufactured of ultra fine wirings on a thin copper foil-clad copper-clad substrate.
A method for manufacturing a printed circuit substrate, having the ultra fine wiring pattern comprises the steps of applying electroless copper plating of 0.1 to 1 μm and then electric copper plating of 0.5 to 3 μm by using an ultra thin copper foil (a), having a copper foil thickness of 5 μm or less of an outermost layer formed with a through-hole and/or a blind via hole, adhering a plating resist (h), then making electric copper plating of 6 to 30 μm to adhere, further making adhering plating resist (j) thereon, making nickel plating and gold plating or solder plating to adhere at a position in which the plating resist is not adhered, peeling off the resist, and then melt removing a thin electrical copper plating layer (g), an electroless copper plating layer (f) and the ultra fine copper foil layer by etching to form a pattern of line/space = 40/40 μm or less. Accordingly, the high-density printed circuit substrate having the very small undercut of the pattern and superior copper foil adhering force can be obtained.
IKEGUCHI NOBUYUKI
KOMATSU KATSUJI
| JPS6481296A | 1989-03-27 | |||
| JP2002016356A | 2002-01-18 | |||
| JP2000114693A | 2000-04-21 | |||
| JPH0469992A | 1992-03-05 | |||
| JPH0316296A | 1991-01-24 |
Next Patent: ELECTRONIC MODULE AND MANUFACTURING METHOD THEREFOR