To provide a method of manufacturing a printed wiring board which is provided with a component mounting section and contact section, both of which are formed of a conductor and are formed on one and the same plane of a base material, where discoloration due to the corrosion of a conductor which constitutes the component mounting section is prevented, when an electroless nickel/gold plating layer is formed only on the conductor which constitutes the contact section.

After forming the electroless nickel/gold plating layers 5, 6 on the conductor which constitutes contact section 2b, a dry film photoresist 4 which has been protecting the component-mounting section 2a is peeled off, using an alkaline remover added with benzotriazole.