Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PAD WIRING BOARD ELECTRONIC PHOTOGRAPH PHOTOSENSITIVE BODY
Document Type and Number:
Japanese Patent JP2001352148
Kind Code:
A
Abstract:
To provide a method for manufacturing an electronic photograph type printed wiring board having a practical ultraviolet light sensitivity, and an electronic photograph photosensitive body.
A metal conductive layer is provided on an electric insulation base material, and an optical conductive layer containing an electric charge transport substance and an alkali soluble resin is provided in its upper layer, thereby providing an electronic photograph type printed wiring board which has a practical ultraviolet light sensitivity and is superior in a fine line repeatability.
Inventors:
TAKADA MASAKAZU
HORIUCHI TAMOTSU
NAZUKA MASANORI
HORIUCHI TAMOTSU
NAZUKA MASANORI
Application Number:
JP2000168666A
Publication Date:
December 21, 2001
Filing Date:
June 06, 2000
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
G03G5/05; G03G5/06; H05K3/06; (IPC1-7): H05K3/06; G03G5/05; G03G5/06