Title:
マルチチップモジュール作製用の疑似ウエハを作製する方法
Document Type and Number:
Japanese Patent JP4724988
Kind Code:
B2
Inventors:
Yuji Takaoka
Application Number:
JP2001269051A
Publication Date:
July 13, 2011
Filing Date:
September 05, 2001
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/56; H01L23/28; H01L21/02; H01L21/60; H01L23/12
Domestic Patent References:
| JP61156792A | ||||
| JP2001028422A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama