Title:
METHOD OF MANUFACTURING QUANTITATIVELY CUT CHIP AND METHOD OF MANUFACTURING METAL SPHERE USING THE CHIP-MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005342559
Kind Code:
A
Abstract:
To provide a method of manufacturing a quantitatively cut chip being excellent in quality, cost, precision and productivity and available in application for e.g. electronic devices and a method of manufacturing a metal sphere using the chip.
The chip-manufacturing method comprises cutting a wire strand composed of two or more twisted metal fine wires of a diameter of ≤200 μm with predetermined intervals three times or fewer the diameter of the strand. Preferably, the maximum tensile load of the strand is ≥0.2 kgf, and the metal wires are made of Cu. The sphere-manufacturing method comprises heating the chips obtained by the chip-manufacturing method in a fluid, preferably a gas, with plasma as a heat source to spheroidize.
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Inventors:
CHIWATA NOBUHIKO
NISHI YUICHI
MIKAMOTO TSUKASA
NISHI YUICHI
MIKAMOTO TSUKASA
Application Number:
JP2004162000A
Publication Date:
December 15, 2005
Filing Date:
May 31, 2004
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
B21F11/00; B01J2/00; H01L21/60; (IPC1-7): B01J2/00; B21F11/00; H01L21/60
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