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Title:
METHOD FOR MANUFACTURING RE-BONDED CHIP PRODUCT FOR VEHICLE AND RE-BONDED CHIP PRODUCT FOR VEHICLE
Document Type and Number:
Japanese Patent JP2002154164
Kind Code:
A
Abstract:

To provide a re-bonded chip product for a vehicle such as a lightweight seat cushion having proper hardness or a floor mat having sufficient hardness and excellent in fogging resistance, and the re-bonded chip product.

A mixture of p-MDI and TDI or a prepolymer prepared using a raw material containing 100 mass pts. of p-MDI, 10-50 mass pts., especially 15-40 mass pts. of polyol with a mol.wt. of 1,000-4,000 and a hydroxyl number of 250 or less, especially, 40-120 and 5-40 mass pts. of a plasticizer with a mol.wt. of 395 or more and a boiling point of 340°C or higher or propylene carbonate is used as a binder to manufacture the re-bonded chip product for a vehicle. The viscosity of the polyol at 25°C is preferably 400 mPa s or less and, as the plasticizer used as a diluent, diisononyadipate or the like is preferably used.


Inventors:
YANO TSUTOMU
Application Number:
JP2000353002A
Publication Date:
May 28, 2002
Filing Date:
November 20, 2000
Export Citation:
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Assignee:
INOUE MTP KK
International Classes:
B60R13/02; B29C67/20; C08G18/76; C08K5/12; C08K5/1565; C08L75/04; (IPC1-7): B29C67/20; B60R13/02; C08G18/76; C08K5/12; C08K5/1565; C08L75/04
Domestic Patent References:
JPH08208800A1996-08-13
JPH02215518A1990-08-28
JP2000248033A2000-09-12
JPH06184345A1994-07-05
JPH1052866A1998-02-24
JP2000017032A2000-01-18
JPH06228259A1994-08-16
JPH0912667A1997-01-14
JPH08208800A1996-08-13
JPH02215518A1990-08-28
JP2000248033A2000-09-12
JPH06184345A1994-07-05
JPH1052866A1998-02-24
JP2000017032A2000-01-18
JPH06228259A1994-08-16
JPH0912667A1997-01-14
Attorney, Agent or Firm:
Kojima Kiyoji