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Title:
METHOD OF MANUFACTURING RE-RELEASABLE PROCESS FILM FOR FLEXIBLE PRINTED WIRING BOARD AND LAMINATING METHOD
Document Type and Number:
Japanese Patent JP2011061215
Kind Code:
A
Abstract:

To provide a method of manufacturing a re-releasable process film for flexible printed wiring boards, that can prevent adhesive deposit on the surface of a wiring board and suppress generation of curling of the wiring board in the process for manufacturing electric and electronic equipment using the flexible printed wiring board.

The method is provided for manufacturing a re-releasable process film laminated on the flexible printed wiring board, the film having a base film and an adhesive layer formed of a specific composition and provided on one surface of the substrate film, in which the adhesive layer having three specific physical properties is obtained by controlling the amount of a cross linking agent contained in the adhesive layer, and the base film is coated with the adhesive layer.


Inventors:
OTSUKI JUNICHI
INOUE MAKOTO
TETSUMOTO TAKUYA
Application Number:
JP2010225228A
Publication Date:
March 24, 2011
Filing Date:
October 04, 2010
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
H05K3/28; B32B27/00; B32B27/30; C09J7/02; C09J11/06; C09J175/04
Domestic Patent References:
JP2003190883A2003-07-08
JP2000044896A2000-02-15
JPH10330722A1998-12-15
JP2003327933A2003-11-19
JP2003138206A2003-05-14
JP2004051812A2004-02-19
Attorney, Agent or Firm:
Mitsuru Uchiyama



 
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